LIGHT EMISSION EQUIPMENT AND MANUFACTURING METHOD OF THE LIGHT EMISSION EQUIPMENT

专利摘要:
light-emitting apparatus and method of manufacturing the light-emitting apparatus the invention relates to a light-emitting apparatus which includes a basic body that forms a recess defined by a lower surface and a side wall thereof, a conducting member, whose upper surface is exposed in the recess, and whose lower surface forms an outer surface, a protruding portion arranged in the recess, a light-emitting element mounted in the recess and electrically connected to the conductive member and a sealing member arranged in the recess to cover the light emitting element. the basic body has a lower portion and a side wall portion formed entirely by a resin, an inner surface of the side wall portion which is the side wall that defines the recess and which has a curved portion and the protruding portion which is arranged in the proximity to the curved surface. with this arrangement, the thin and small light emitting device is excellent at extracting light, and it can be obtained effectively and safely.
公开号:BR112012003202B1
申请号:R112012003202-0
申请日:2010-10-28
公开日:2020-02-18
发明作者:Shinji NISHIJIMA；Tomohide Miki；Hiroto Tamaki
申请人:Nichia Corporation；
IPC主号:

专利说明:

DESCRIPTIVE REPORT
Patent application for “LIGHT EMISSION APPLIANCE AND METHOD OF MANUFACTURING THE LIGHT EMISSION APPLIANCE”
Fundamentals of the Invention
Technical Field [0001] The present invention relates to a resin package and a method of manufacturing the resin package, which is usable for a light emitting device applicable to imaging equipment, lighting equipment, display, source of backlight for liquid crystal display, or similar, and particularly for the packaging of resin of the small and high security type, the light emitting device uses resin packaging and a method of manufacturing the emission device of light.
State of the Art [0002] In accordance with the new trend in reducing the size and weight of electronic devices, several types of small light emitting devices (light emitting diodes) have been developed to be mounted on a device electronic. These light emitting devices employ, for example, a double-sided printed circuit board with through hole, including an insulating substrate with a pair of metallic conductive models formed on each of the two sides of the insulating substrate. These light emitting devices have a structure in which the light emitting element is mounted on the double-sided printed circuit board with through hole, and the metallic conductor models and the optical semiconductor element are electrically connected using wires or similar.
[0003] Meanwhile, light emitting devices require,
Petition 870190088974, of 09/09/2019, p. 6/60 / 49 essentially a double-sided printed circuit with through hole. The double-sided printed circuit board with through hole has a thickness around at least 0.1 mm, which is a factor preventing the drastic reduction in the thickness of the surface-mounted light emitting devices. In addition, the substrates have lower processing precision compared to that of resin packaging, being unsuitable for the abovementioned reduction. For this reason, a light emitting device has been developed that does not contain a printed circuit (for example, as described in Patent Document 1).
Patent Document 1: JP 2005-79329A
Presentation of the Invention
Problems to be solved by the Invention [0004] In the light emission apparatus presented in JP 200579329A, a thin metallic film is formed as an electrode on the substrate, using techniques, such as vapor deposition, which is sealed with the emission element of light by an optically transmissive resin, allowing the thickness of the device to be reduced compared to conventional surface-mounted light emitting devices.
[0005] However, only optical transmissive resin is used in this light emitting device, so that the light from the light emitting element penetrates downwards, resulting in reduced light extraction efficiency. It is also presented a structure that has a metallic and conical film to reflect light, however the formation of irregularity in the substrate is necessary for the disposition of the metallic film. In this case, because the size of the light emitting device has been reduced, the irregularity is necessarily microscopic, which not only prevents processing but also tends to cause problems that, due to the irregular structure, cause the device to break at the moment the substrate is removed, leading to
Petition 870190088974, of 09/09/2019, p. 7/60 / 49 decrease in production. In the case where the light emitting device is used on a display, or similar, the problem also arises that low contrast will occur when only optical transmissive resin is used. For this reason, a rim member can be attached to the metal film so that a little light can penetrate, but the thickness increases accordingly. The present invention is intended to solve the problems described above, and its main object is to present a thin type resin package, with excellent light extraction efficiency, and a light emission device that uses resin packaging and a method manufacturing process.
Troubleshooting Means [0006] To solve the problems described above, the light emitting apparatus according to the present invention includes a basic body that forms a recess defined by a lower surface and a side wall thereof, a member conductor whose upper surface is exposed in the recess and whose lower surface forms an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member and a sealing member disposed in the recess to cover the light emitting element. The basic body has a lower portion and a side wall portion entirely formed by resin. The inner surface of the side wall portion is the side wall that defines the recess and has a curved portion. The protruding portion is arranged in proximity to the curved surface. With this arrangement, it is possible to obtain a light-emitting device, thin and small, with safety and excellent efficiency in the extraction of light.
[0007] The protruding portion can be arranged on the lateral surface that defines the recess. The inner surface of the side wall portion that defines the recess has an inclined portion in which the degree of the angle of inclination is inconsistent, and the protruding portion can be arranged in the portion
Petition 870190088974, of 09/09/2019, p. Slanted 8/60 / 49. The protruding portion is preferably arranged on the curved portion of the inner surface that defines the recess. In addition, the protruding portion may be arranged on the inner surface of the side wall portion in a position closer to the lower surface than that of the upper surface. Alternatively, the protruding portions can be arranged in a plural number in the recess in a height direction or in a horizontal direction.
[0008] In addition, the inner surface of the side wall portion that defines the recess has a flat portion and a curved portion, and the protruding portion may be arranged in the curved portion. The conducting member can also be a galvanized layer. The basic body can also be formed by a thermosetting resin.
[0009] In addition, a depression may be present in the lower portion of the basic body of the light emitting apparatus. The basic body that defines the recess can be presented with a depression in its upper surface of the lower portion. That is, the bottom surface that defines the recess may not be formed by a flat shape, but by a shape that presents a partial depression. Naturally, the bottom surface is not flat, but it has an irregular shape, so that the adhesion between the sealing member and the bottom surface can be increased.
[0010] Another light emitting device includes a basic body that forms a recess defined by a lower surface and a side wall thereof, a conducting member whose upper surface is exposed in the recess and whose lower surface forms an outer surface, an element of light emission mounted in the recess and electrically connected to the conductive member and a sealing member disposed in the recess to cover the light emission element, the basic body is made of resin with its bottom portion and side wall portion formed integrally, which can be A depression is shown on the bottom surface of the recess.
Petition 870190088974, of 09/09/2019, p. 9/60 / 49
Naturally, the bottom surface is not flat, but has an irregular shape, so that the adhesion between the sealing member and the bottom surface can be increased.
[0011] Another light emitting device includes a basic body that forms a recess defined by a lower surface and a side wall thereof, a conducting member whose upper surface is exposed in the recess and whose lower surface forms an outer surface, an element of light emission mounted in the recess and electrically connected to the conducting member and a sealing member disposed in the recess to cover the light emitting element. The basic body has a lower portion and a side wall portion integrally formed by resin, the inner surface of the side wall portion has a protruding portion in a position closer to the lower surface than that of the upper surface. With this arrangement, it is possible to obtain a light-emitting device, thin and small, with safety and excellent efficiency in the extraction of light. In addition, the inner surface of the side wall portion that defines the recess has a flat portion and a curved portion, and the protruding portion can be arranged in the curved portion. It is preferable that the protruding portions are arranged in a plural number in the recess in a height direction or in a horizontal direction. In addition, the conducting member can be a galvanized layer. The basic body can also be formed by a thermosetting resin.
[0012] The resin package of the present invention includes a basic body that forms a recess defined by a lower surface and a side wall thereof, a conductive member exposed on the lower surface of the recess and whose lower surface forms an outer surface, and a portion protuberance arranged in the recess. The basic body has a lower portion and a side wall portion entirely formed by a resin, an inner surface of the side wall of the recess has a
Petition 870190088974, of 09/09/2019, p. 10/60 / 49 portion of curved surface. The protruding portion is arranged in the vicinity of the curved surface portion. With this arrangement, the clamping force can be increased with a member that can be arranged in the recess.
[0013] Another resin package includes a basic body that forms a recess defined by a lower surface and a side wall thereof, a conducting member exposed on the lower surface of the recess and whose lower surface forms an outer surface and a sealing member disposed in the recess. The basic body has a lower portion and a side wall portion formed entirely by a resin and a depression is presented on the lower surface of the recess.
[0014] In addition, the method of manufacturing the light emitting apparatus may include a step of preparing a conductive member, a step of disposing a mold release film on an interior surface of a mold that presents a superior mold and a lower mold, so that the mold release film is stretched to suit the projecting portion of the mold, the conducting member being interposed between the upper mold and the lower mold of the mold, a resin injection step in the mold and with the resin's fluid resistance, stretching the mold release film to exceed its stretch limit to form an opening in the release film in a position on the side surface of the mold corresponding to the interior surface of the base body recess after be shaped, also forming a protruding portion on an interior surface of the recess in a basic body shapes do, a step of connecting the light emitting element to a lower surface of the recess and a step of filling a sealing resin in the recess.
[0015] In another method of manufacturing the light emitting apparatus, a conductive member can be formed on the surface of a support substrate by means of galvanizing.
Petition 870190088974, of 09/09/2019, p. 11/60 / 49 [0016] In addition, the method of manufacturing the resin package includes a step of preparing the conductive member, a step of disposing a mold release film on the inner surface of the mold which has an upper mold and a lower mold, so that the mold release film is stretched to suit the protruding portion of the mold, the conductive member being interposed between the upper mold and the lower mold of the mold, a step of resin injection into the mold and with the fluid resistance of the resin, stretching the mold release film to exceed its stretch limit to form an opening in the release film in a position on the side surface of the protruding portion of the mold corresponding to the inner surface that defines the recess of the basic body after being molded, also forming a protruding portion on an interior surface that defines the rec in a basic molded body.
[0017] In another method of manufacturing the resin packaging, a conductive member can be formed on the surface of a support substrate by means of galvanizing.
Effect of the Invention [0018] The emission and light apparatus, according to the present invention, is capable of preventing the light from the light emitting element from escaping from the bottom side, so that it can be obtained in the light emitting device increased efficiency in the extraction of light, towards its upper side, with a good yield in its manufacture.
Brief Description of the Drawings [0019] FIG. 1A is a perspective view showing the light emitting apparatus in accordance with Mode 1 of the present invention.
[0020] FIG. 1B is a cross-sectional view of the light emitting apparatus of FIG. 1A considered along the IB-IB 'line.
Petition 870190088974, of 09/09/2019, p. 12/60 / 49 [0021] FIG. 2A is a perspective view showing the light emitting apparatus, in accordance with Modality 2 of the present invention.
[0022] FIG. 2B is a cross-sectional view of the light emitting apparatus of FIG. 2A considered along line IIB-IIB '.
[0023] FIG. 2C is a cross-sectional view of the light emitting apparatus of FIG. 2A considered along the line IIC-IIC '.
[0024] FIG. 2D is a partially enlarged view of an example of a depression variant.
[0025] FIG. 3 is a partially enlarged view of an example of a protruding portion variant.
Form (s) of Execution of the Invention [0026] The description below describes the modalities, according to the present invention, with reference to the drawings. Preferred embodiments are described herein to exemplify the light emitting apparatus and the method of manufacturing the light emitting apparatus, and the present invention is not limited to the modalities. In addition, it should be noted that the members presented in the appended claims are not specifically limited to members in the modalities. Unless otherwise specified, any dimensions, materials, shapes and related dispositions of the members described in the modalities are presented by way of example, not limitation. In addition, the members' sizes and disposition relationships in each of the drawings are occasionally presented in an exaggerated size to facilitate explanation. The same or similar members as those of this invention are attached with the same designation and the same reference numbers, their description being omitted.
Example 1 [0027] The light emitting apparatus 100 of Example 1 is shown in
FIG. 1A and FIG. 1B. FIG. 1A is a perspective view showing the device
Petition 870190088974, of 09/09/2019, p. 13/60 / 49 of light emission 100 and FIG. 1B is a cross-sectional view showing the light emitting apparatus 100 shown in FIG 1A, seen along the line IB-IB '.
[0028] In example 1, the light emitting apparatus 100 includes, as shown in FIG. 1A and FIG. 1B, a basic body 101 presented with a recess S defined by a lower surface and a lateral surface, and a pair of conductive members 102 whose upper surfaces are exposed on the lower surface of recess S. The conductive members 102 are arranged so that its lower surface has an outer surface of the light emitting device 100 and, together with the basic body 101, constitute a part of the bottom surface of the light emitting device 100. In the recess S, the light emitting element 102 is mounted with the use of a connecting member (not shown) and electrically connected to the respective conductive members 102 by a conductive wire 105, or similar. In addition, an optically transmissive sealing member 104 is disposed in recess S to cover light emitting element 103, or the like.
[0029] Furthermore, the basic body 101 has the lower portion 101b and the side wall portion 101a formed entirely of resin, and a protruding portion 101c is formed on the inner surface of the side wall portion 101a in a position closer to the surface lower than that of the upper surface.
(Basic Body) [0030] In the present modality, the basic body 101 is made with resin, and added with a filling substance of various types of light blocking filling substances, capable of blocking the light of the light emitting element 103, being willing to contain conductive members 102 that act as a pair of positive and negative electrodes.
[0031] The lower portion 101b is presented in the basic body 101 for electrical isolation between the conducting members, preventing light
Petition 870190088974, of 09/09/2019, p. 14/60 / 49 escape from the bottom surface side of the light emitting apparatus 100, thereby improving the efficiency of light extraction from the light towards the upper surface. In addition, the side wall portion 101a is presented in the basic body 101, so that the recess S is formed, preventing light emission on the side surface side of the light emitting apparatus 100, which allows for an efficient light emission towards the upper surface. The lower portion 101b and the side wall portion 101a of the basic body are integrally formed by the same resin, so that light is prevented from escaping by the absence of a joining portion, and this allows for effective formation with a single manufacturing step.
[0032] The height (depth) of the recess S from the bottom surface to the top surface is preferably 0.5 mm or less, more preferably 0.4 mm or less, still preferably 0.35 mm or less. In case the recess is relatively small in depth, the contact area with the sealing member filled in the recess is small, which can cause a reduction in adhesion. In this way, the protruding portion shown on the interior surface of the side wall portion, as in the present invention, can show improved adhesion between the basic body and the sealing member.
[0033] In the case where the surfaces of the conductive members are made with Ag, they are prone to be deteriorated (sulfated) by the sulfur-containing gas. Therefore, it is preferable to use a rigid material for the sealing member. However, this material tends to loosen at the interface, with the interior surface of the side wall portion, due to the thermal stress applied at the time of reflux assembly. However, with the protruding portion, as in the present invention, a decrease in material detachment can occur. Particularly, in the case where the depth of the recess is small, the distance from the surface of the sealing member to the conducting members becomes small, so that, with
Petition 870190088974, of 09/09/2019, p. 15/60 / 49 the use of the protruding portion, as in the present invention, a reduction of detachment can occur even though the sealing member is relatively of the rigid type.
[0034] An appropriate shape can be used in relation to the outer shape of the basic body, examples of the shape include a rectangular shape in the top view, as shown in FIG. 1A, as well as a square shape, polygonal shape, circular shape, and a shape that is a combination of these shapes. An appropriate shape can also be employed in relation to the shape of the recess opening, such as a square shape, rectangular shape, circular shape, ellipsoidal shape, rail shape, polygonal shape, or a shape that is a combination of these shapes. The rail shape is preferable, in which case the rectangular shape of the basic body in the top view preferably includes a linear portion in an approximately central portion in the longitudinal direction and a curved portion in the lateral direction.
[0035] It is preferable that the inner surface of the side wall of the recess is perpendicular to the lower surface, or, as shown in FIG. 1B, be tilted so that the recess is wider on the upper surface side than on the lower surface side. In the case where the basic body is formed using a mold with a mold release film, the mold release film that has elastic properties can be used so that the corners between the bottom surface and the inner surface of the recess acquire a rounded shape. In this case, the side wall is formed, so that the inner surface of the side wall extends continuously over the conductive members towards the central portion of the base of the recess, with a gradual decrease in its thickness. With the rounded corners, the sealing member can be arranged in the recess without containing air, and the tension generated at the moment of stiffness can be dispersed, so that the sealing member
Petition 870190088974, of 09/09/2019, p. 16/60 / 49 seal is not detached from the basic body.
[0036] According to the present invention, the protruding portions
101c are formed on the inner surface of the side wall portion 101a, and the protruding portions 101c are also integrally formed with the lower portion 101b and the side wall portion 101a. The protruding portions 101c are, as shown in FIG. 1A and FIG. 1B, formed on the inner surface of the side wall portion at positions closer to the lower surface than to the upper surface. Preferably, the protruding portions are arranged to be extended towards the height of the inner surface, from the proximity of the center, towards the lower surface, both reaching the lower surface in the recess, or, as shown in the figures, being spaced from the lower surface .
[0037] The protruding portions can be arranged at any locations on the inner periphery of the recess, however, as shown in FIG. 1A, in the case where the recess is such that the upper surface defines the opening of the recess in the form of a race track in the upper view, which has a linear portion and a curved portion, the interior surface including a corresponding portion flat and a curved surface, the protruding portions are preferably arranged on a curved portion of the interior surface of the recess. The protruding portion is preferably arranged in the portion where the angle of the inner surface changes, for example, a curved surface that has a different radius of curvature than the other portions, a corner, or a portion close to them. As described above, the arrangement of the protruding portion, in the vicinity of the curved surface integrally with the recess, leads to an increase in mechanical strength in the basic body. In particular, the arrangement of a plurality of protruding portions close to the curved surface allows to increase the force on the curved surface on which the tension is concentrated, and its safety can be increased. For example, in FIG. 1A, four protruding portions 101c are
Petition 870190088974, of 09/09/2019, p. 17/60 / 49 arranged in a curved portion of the inner surface. This portion may be subject to the stress generated by the retention at the time of tightening of the sealing member 104. In this way, the portion can be easily released by the thermal stress caused by the retention of the cure, reflux or the like. The detachment between the sealing member 104 and the basic body 101 makes the conductive wires 105 connected to the respective conductive members 102 easily subject to tension. This can cause problems, such as disconnection of the conductive wire or the like, but the arrangement of the protruding portions 101c allows to reduce the influence caused by the detachment, so that the occurrence of detachment of the strand can be reduced. As described above, the interior surface of the side wall portion that defines the recess has a portion where the angle of inclination changes. In this way, with the arrangement of the protruding portion in the portion in which the angle of inclination of the interior surface changes, the adverse effects can be reduced in this position exerted by the detachment. As shown in FIG. 1B, the arrangement of the protruding portion 101c on the inner surface of the basic body 101, which defines the recess S, allows to improve the connection on the surface between the sealing member 104 filled in the recess and the basic body 101, so that there is improvement in adhesion. In particular, the protruding portion shown, which has a convex and protruding shape towards the center of the recess, promotes an anchor effect. Furthermore, with the arrangement of the protruding portion on the interior surface, which defines the recess in which the light emitting element is disposed, the light from the light emitting element can be reflected diffusely, so that there is a prediction of a better efficiency in the extraction of light on the outside.
[0038] In FIG. 1A, four protruding portions are arranged in a curved portion, however the present invention is not limited to this, a protruding portion or a plurality of these may be arranged. The plurality
Petition 870190088974, of 09/09/2019, p. 18/60 / 49 of the protruding portions can be arranged in the recess not only in a single direction in the height or lateral direction, but also plurally in a two-dimensional arrangement. Furthermore, it is not necessary to arrange the protruding portions in the same way and with the same number in the two curved positions, and the protruding portions can be arranged in each of the curved portions with different shapes and / or different numbers. In addition, the protruding portion may be arranged on the flat portion.
[0039] In the present embodiment, a plurality of protruding portions 101c that have an elliptical shape are spaced apart, however the shape can be a circular shape, quadrangular shape, polygonal shape, or a shape that is a combination of these shapes, or still, an irregular shape or in which one or more of these shapes are partially connected. In particular, the protruding portion of a shape that has a part, the width of which is greater on the side closest to the bottom surface than on the side closest to the top surface of the recess, or in a shape arranged in a spaced and distant position from the surface bottom of the recess, can only be performed with the use of an elastic film to release the mold, which is preferable.
[0040] The basic body 101 can be made with any materials, as long as they are able to block the light from the light emitting element 103. It is preferable, however, a material that presents a small difference in the coefficient of linear expansion in the support substrate. In addition, the insulating member is preferably used. Examples of preferred materials include resin, such as thermosetting resin or thermoplastic resin. Particularly, in the case where the thickness of the conductive members is around 25 pm to 500 pm, particularly in the case where the thickness is very small, around 25 pm to 200 pm, thermosetting resin is preferably used,
Petition 870190088974, of 09/09/2019, p. 19/60 / 49 thus, a basic body of a very fine type can be obtained. Specific examples include (a) epoxy resin composition, (b) silicone resin composition, (c) modified epoxy resin composition, such as silicone modified epoxy resin, (d) modified silicone resin composition, as resin composition of epoxy modified silicone, (e) polyimide resin composition and (f) modified polyimide resin composition.
[0041] In particular, a thermosetting resin, such as that described in JP 2006-156704A, is preferable. Among the thermoset resins, for example, epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, urethane resin and the like are preferably used. More specifically, it is preferable to use a solid epoxy resin composition that contains a colorless and transparent mixture prepared by mixing and dissolving equivalent amounts of (i) epoxy resin composed of triglycidyl isocyanurate and hydrogenated bisphenol A triglycidyl ether and (ii) acid anhydride composed of hexahydrophthalic anhydride, 3-anhydride-methyl-hexahydrophthalic and 4-anhydride-methyl-hexahydrophthalic. It is also preferable to use a stage B solid epoxy resin composition obtained by adding 0.5 parts by weight of DBU (1,8-diazabicyclo (5.4.0) undecene-7) as a curing accelerator, 1 part by weight of ethylene glycol as a co-catalyst, 10 parts by weight of a titanium oxide pigment and 50 parts by weight of a glass fiber to 100 parts by weight of the mixture described above, in addition to the application of heat for curing partial of this.
[0042] It is also preferable to use a thermosetting epoxy resin composition whose essential component is an epoxy resin containing a triazine-derived epoxy resin, described in WO 2007/015426. For example, an epoxy resin derived from triazine 1,3,5 is preferably contained. In particular, the epoxy resin that has a
Petition 870190088974, of 09/09/2019, p. 20/60 / 49 isocyanurate ring has excellent resistance to light and electrical insulation. It is desirable to have a divalent and, more preferably, trivalent epoxy group per isocyanurate ring. Specifically, tris (2,3-epoxypropyl) isocyanurate, tris (a-methylglycidyl) isocyanurate or the like can be used. The epoxy resin derived from triazine preferably has a softening point between 90 and 125 ° C. The epoxy resin derived from triazine can also be used with a hydrogenated epoxy resin or other epoxy resins. In addition, in the case where the silicone resin composition is used, silicone resin which contains a methyl silicone resin is preferably used.
[0043] The case in which triazine-derived epoxy resin is used is described below in a specific way. It is preferred that the acid anhydride, which acts as a curing agent, is used with an epoxy resin derived from triazine. In particular, acid anhydride, which is non-aromatic, and does not include a carbon-carbon double alloy, is used to improve resistance to light. Specific examples of this include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trialkyltertrahydrophthalic anhydride, hydrogenated methylnadic anhydride and the like. In particular, methylhexahydrophthalic anhydride is preferable. It is also preferable to use an antioxidant, for example, a sulfur-based or phenol-based antioxidant. A known curing catalyst can be used for epoxy resin compositions as a curing agent.
[0044] In addition, a filler to impart light-blocking properties or various additives, where appropriate, can be mixed with this resin. In the present specification, the expression "light blocking resin that constitutes the basic body 106" includes those described above. The light transmission can be adjusted with the mixture of fine particles, or similar, of TiO ₂ , SiO ₂ , Al ₂ O ₃ , MgO, MgCO ₃ , CaCO ₃ , Mg (OH) ₂ , Ca (OH) ₂ , or similar, as a filler. It's preferable
Petition 870190088974, of 09/09/2019, p. 21/60 / 49 block around 60% or more, more preferably around 90% or more of the light from the light emitting element. The basic body 106 is capable of reflecting or absorbing light. In the event that the light emitting device is used in a lighting application or similar, it is preferable that the light is blocked by reflection. In this case, the reflectivity to the light of the light emitting element is preferably 60% or more, more preferably 90% or more.
[0045] The various types of fillers, as described above, can be adjusted separately or in combination of two or more. For example, a filler to adjust reflectivity and a filler to adjust the linear expansion coefficient, which are described later, can be used together.
[0046] For example, in the case where TiO2 is used as a white filler, it is preferably added around 10 to 30% by weight, more preferably around 15 to 25% by weight. Rutile and anastase-type TiO2 can be used. Due to the light blocking property and the light resistance property, the rutile type is preferable. In addition, in the case where improvement in dispersibility and resistance to light is aimed, a filler substance modified by surface treatment can also be used. Oxide or oxide hydrate, such as alumina, silica and zinc oxide, can be used to treat the surface of a filler made with TiO2. In addition to those described above, SiO2 is preferably added on a scale of between 60 and 80% by weight, more preferably between 65 and 75% by weight, as a filler for the main adjustment of the linear expansion coefficient. In relation to the SiO2 described above, amorphous silica, which has a lower coefficient of linear expansion than that of silica, is preferably employed.
Petition 870190088974, of 09/09/2019, p. Crystalline 22/60 / 49. The filler preferably has a particle size of 100 μm or less, more preferably 60 μm or less. In addition, the particle size of the filler is preferably spherical, which can improve the effectiveness of the fill when molding the basic body. To improve the image contrast in the application, such as a display, the filler preferably has a light absorption of 60% or more, more preferably 90% or more, with respect to the light emitted from the light emitting element. In this case, the filler, such as (a) black acetylene-type carbon, activated carbon and graphite, (b) transmission metal oxide, such as iron oxide, manganese dioxide, cobalt oxide or molybdenum oxide or ( c) organic pigment can be used, according to the purpose of the application.
[0047] The linear expansion coefficient of the basic body is preferably adjusted on a scale between 7x10-6 / K and 20x10 ^-6 / K. With this, the distortion generation can be more easily contained during the cooling step after the formation of the basic bodies, so that a good production yield is obtained. In the present specification, the expression “linear expansion coefficient” refers to the linear expansion coefficient of the basic body, which is formed by the light-blocking resin prepared with the addition of various fillers, at a temperature below the transition temperature of this glass.
[0048] From another point of view, the basic body is preferably adjusted to present a small difference in the coefficient of linear expansion with respect to the conductive member. The difference with respect to the conductive member is preferably 50% or less, more preferably 40% or less, and still preferably 20% or less. Naturally, the conducting limbs and the basic body can be prevented from being detached in the separate light emitting devices individually. This
Petition 870190088974, of 09/09/2019, p. 23/60 / 49 way, light emitting devices that are highly safe can be obtained. It goes without saying that, in the present specification, the term “resin packaging” is included not only in a state after cutting the conductive frame, but also in a state before cutting.
[0049] In the case where the galvanized material (electroformed material) is used for the conductive member, the conductive member is preferably adjusted to present a small difference in the linear expansion coefficient with respect to the support substrate that must be removed before devices to be separated individually. The difference is preferably 30% or less, more preferably 10% or less. In the case where the SUS board is used for the support substrate, the difference in the linear expansion coefficient is preferably 20 ppm or less, more preferably 10 ppm or less. In this case, the content of the filler is preferably 70% by weight or more, more preferably 85% or more. With this arrangement, the residual stress on the support substrate and the basic body can be controlled (relaxed), so that distortion can be reduced in the aggregate of the optical semiconductors before being cut individually. The reduction of distortion reduces, in turn, the risk of disconnection of the conductive wire inflicted on the internal part of the devices and can contain the positional error when the individual devices are separated, so that a good production efficiency is obtained. For example, the linear expansion coefficient of the basic body is preferably adjusted on a scale between 5x106 / K and 25x10-6 / K and, more preferably, on a scale between 7x10-6 / K and 15x10-6 / K. With this, the distortion generation can be more easily contained during the cooling step after the formation of the basic bodies, so that a good production yield is obtained. In the present specification, the expression “linear expansion coefficient” refers to the linear expansion coefficient at a temperature below the temperature
Petition 870190088974, of 09/09/2019, p. 24/60 / 49 transition of the glass of the basic body formed by the light blocking resin that is prepared with the use of various fillers. On this temperature scale, the linear expansion coefficient of the basic body is preferably close to the linear expansion coefficient of the support substrate.
[0050] From a different point of view, in the case where the galvanized material (electroformed material) is used for the conductive member, the basic body is preferably adjusted to present a small difference in the linear expansion coefficient with respect to the member conductor. The difference is preferably 50% or less, more preferably 40% or less, and still preferably 20% or less. Naturally, in individually separated light-emitting devices, the conducting member and the basic body can be prevented from shedding, in this way, light-emitting devices that are highly safe can be obtained.
(Conductive Member) [0051] The conducting member aims to act as a pair of electrodes to supply electricity to the light emitting element. In the present modality, the conducting member is electrically connected to the light emitting element using a conductive wire or pump, acting as a pair of electrodes to supply electricity from outside. The light emitting element can be mounted on a conducting member, directly or indirectly, by another member, as a subassembly. In addition, a conducting member can be employed that does not contribute to the conduction of electricity, but is merely used to assemble the light emitting element.
[0052] In the present embodiment, the conducting member is arranged to form an outer surface of the lower surface of the light emitting apparatus, that is, to be exposed externally (on the lower surface) without being
Petition 870190088974, of 09/09/2019, p. 25/60 / 49 covered by the sealing member or similar. The shape, size and related data of the conducting member can be selected appropriately, according to the size of the light emitting device, the number and size of the light emitting elements to be assembled.
[0053] The upper surface of the conducting limb is preferably a horizontal plane, however it can present microscopic irregularity, grooves, holes or similar. Likewise, the lower surface of the conductive member is also preferably a flat surface, but it can also show microscopic irregularity.
[0054] The lateral surfaces of the conducting member can be flat surfaces. Due to the adhesion, or similar feature, to the basic body, the lateral surface of the conducting member preferably has a protruding protrusion in the basic body 101, as shown in FIG. 1B. It is preferable that the protrusion is arranged in a spaced position on the lower surface of the conductive member 102, and with this, it is unlikely that problems of detachment of the conductive member of the basic body 101. Rather than the protuberance being presented, the surface side of the conducting member can be tilted, so that the lower surface of the conducting member is narrower than the upper surface, and with this, the conducting member can be prevented from detachment.
[0055] The protrusion can be arranged in an appropriate position on the peripheral portion of the conducting member arranged in a position that is different from the outer surface of the light emitting apparatus 100. For example, the protrusion can be arranged locally, only in each one of the two opposite side surfaces of the conducting member which has a rectangular shape in the top view. In order to safely prevent further detachment, the protrusions are preferably formed in relation to the portion surrounding the entire circumference of the conductive member, with the exception of the surface to be the outer surface.
Petition 870190088974, of 09/09/2019, p. 26/60 / 49 [0056] The thickness of the conducting member is preferably between 25 pm and 500 pm, more preferably between 25 pm and 200 pm and still, preferably between 50 pm and 100 pm. In the case where the conductive member is 100 pm or more thick, a metal plate can be used or galvanizing can be carried out. In addition, a side of the conductive member in the direction of thickness can be used as a mounting surface, allowing the obtainment of a light emitting device of the type with side view capable of emitting light in a direction perpendicular to the mounting surface. The conducting member having a very small thickness, such as 100 pm or less, is preferably a galvanized layer formed using the galvanizing method, and is particularly and preferably a pile of galvanized layers.
[0057] The same material is preferably used for each of the conducting members, and the number of manufacturing steps can be reduced, although different materials can also be used. Even so, different materials can be used. Examples of these materials include metals, such as copper, aluminum, gold, silver, tungsten, molybdenum, iron, nickel, cobalt and their alloys (such as ferro-nickel alloy), phosphor bronze, copper containing iron, eutectic welding materials such as Sn, welds like SnAgCu and SnAgCuln and ITO. A particularly preferable material among the solder materials has a composition adjusted so that, once the solder particles are melted and solidified, the alloy between the metal to be bonded and the weld is formed, with the melting point occurring, so that the remelting does not occur in an additional heat treatment, such as in reflux assembly.
[0058] These materials can be used alone or in the form of an alloy. In addition, they can be presented as a plurality of layers by stacking layers (galvanizing) or similarly. For example, in the case where the light emitting element is
Petition 870190088974, of 09/09/2019, p. 27/60 / 49 used as the semiconductor element, a material capable of reflecting light from the light emitting element towards the outermost surface of the conducting member is preferably used. Preferable examples of these include gold, silver, copper, Pt, Pd, Al, W, Mo, Ru, Rh. In addition, the conductive member on the outermost surface preferably has high reflectivity and high brightness. Specifically, the reflectivity on a visible scale is preferably 70% or more, and in this case, Ag, Ru, Rh, Pt, Pd, etc. are preferably used. It is also preferable that the conducting member has a high-gloss surface. The brightness value is preferably 0.3 or more, more preferably 0.5 or more, and still preferably 1.0 or more. The brightness value shown in the specification is a measured value, using one meter of color difference on micro surface VSR 300A, manufactured by NIPPON DENSHOKU INDUSTRIES CO., LTD, in condition of illumination angle of 45 ° C, measurement area of 0.2 mmtp and vertical light reception. It is preferable that the supporting substrate side of the conducting member is made of Au, Sn, Sn alloy, eutectic welder such as AuSn, or the like, which are advantageous to the assembly of the circuit board, or the like.
[0059] Furthermore, the intermediate layer can be formed between the outermost surface (upper layer) of the conductive member and the side of the support substrate (lower layer). To improve the mechanical strength of the conducting member and the light emitting apparatus, a metal that has high corrosion resistance, for example, Ni, is preferably used for the intermediate layer. To improve heat dissipation, copper, which has high thermal conductivity, is preferably used for the intermediate layer. As described above, an appropriate member for the intermediate layer is preferably used, according to the purpose of the application. Pt, Pd, Al, W, Ru, Pd, etc. can also be used. for intermediate layer, as well as the materials described above. The metal that
Petition 870190088974, of 09/09/2019, p. 28/60 / 49 shows good adhesion to the metal in the upper layer and in the lower layer it can be formed in a stacked layer as the intermediate layer. The intermediate layer is preferably thicker than the upper layer of the lower layer. In particular, the thickness is preferably on a scale between 80% and 99% of the total thickness of the conductive member, and is preferably still on a scale between 90% and 99%.
[0060] In the case where the galvanized layer is made with metal elements, the coefficient of linear expansion depends on its composition. In this way, the lower layer and the intermediate layer preferably present a coefficient of linear expansion relatively close to that of the support substrate. For example, in the case where SUS430 has a linear expansion coefficient of 10.4x10 ^-6 / K which is used for the support substrate, the conducting member to be disposed in it can be formed by a stacked layer structure containing metal ( as the main component), as described below. A stacked layer structure is preferable, as on the side of the bottom layer, where Au has a linear expansion coefficient of 14.2x10 ^-6 / K (0.04 to 0.1 pm), a first intermediate layer of Ni that presents a linear expansion coefficient of 12.8x10 ^-6 / K (or Cu that has a linear expansion coefficient of 16.8x10 ^-6 / K) (25 to 100 pm), a second intermediate layer of Au (0.01 to 0, 07 pm) and the upper layer of Ag which has a coefficient of linear expansion of 119.7x10 ^-6 / K (2 to 6 pm). The Ag of the upper layer has a linear expansion coefficient widely different from that of the metals of other layers, however Ag is used due to the light reflectivity of the light emitting element that is established as the priority. The thickness of the Ag of the upper layer is established as very small, so that it has a very small effect on its distortion, presenting few problems of order
Petition 870190088974, of 09/09/2019, p. 29/60 / 49 practice.
(Sealing member) [0061] The sealing member is presented to protect the electronic components, such as light emitting element, light receiving element, protective element and conductive wire from dust, moisture, external force, or similar, disposed in the recess of the basic body. The protruding portion is arranged on the inner surface of the side wall of the recess, preventing the sealing member from being easily detached from the basic body. Particularly, in the case where Ag, which has high reflectivity, is placed on the surface of the conductive member (the surface exposed on the lower surface of the recess), the reflectivity decreases, which in turn decreases the efficiency of light extraction due to discoloration (stain) caused by gas intrusion (particularly a gas containing a sulfur component) which is caused by the detachment between the sealing member and the basic body. However, with the presentation of the protruding portion, as in the present invention, the occurrence of detachment between the sealing member and the basic body can be reduced, and the discoloration of the Ag can be prevented.
[0062] The sealing member is preferably formed of a material that has optical transmissivity, allowing the light from the light emitting element to be transmitted through it, and is resistant to light against deterioration by light. In addition, it is preferable that the material allows little permeation of water vapor and gas containing a sulfur component, etc. and, that, for example, presents water vapor permeability around 50 (g / mm ² .Day) or less (in the thickness of the sealing member of 0.8 mm). In addition, it is preferable for the material to have a stiffness after curing of 30 Shore D or more, where a higher stiffness is preferred, however, due to adhesion to the basic body, 35 D Shore D stiffness is more preferable. to 50. Under the voltage generated by
Petition 870190088974, of 09/09/2019, p. 30/60 / 49 reduction during curing or thermal alteration during operation, the sealing member that presents rigidity can be easily detached from the basic body, however, presenting the protruding portion on the inner surface of the recess that allows to reduce the occurrence of detachment .
[0063] Examples of this material include an insulating resin composition that has optical transmissivity, allowing light from the light emitting element to be transmitted through it, such as silicone resin composition, modified silicone resin composition, epoxy, modified epoxy resin composition and acrylic resin composition. In addition, silicone resin, epoxy resin, urea resin, fluoresin and hybrid resin that contain at least one of these resins can be used. The material is not limited to those organic materials described above, and inorganic material, such as glass or silica solution, can also be used. In addition to these materials, it may also contain, if necessary, coloring agent, light diffusing agent, light reflection material, various fillers, material with wavelength conversion (fluorescent material) or similar. The quantity of the sealing member must be sufficient to cover the electrical components described above.
[0064] The shape of the outer surface of the sealing member can be selected variously, according to the characteristics of the light distribution, etc. For example, the characteristics of the light distribution can be adjusted by forming the upper surface in the form, for example, of a convex lens, concave lens or Fresnel lens. The lens, etc., made of different materials can be additionally presented on the sealing member. In the case where a molded body containing fluorescent material is used (for example, a film shaped body containing fluorescent material or dome shaped body containing fluorescent material), the sealing member is preferably
Petition 870190088974, of 09/09/2019, p. 31/60 / 49 formed by a material that presents excellent adhesion to the molded body that contains fluorescent material. The molded body containing fluorescent material can be formed using organic material, such as glass, as well as using a resin composition.
(Link Member) [0065] The link member (not shown) is a member for mounting and connecting a light emitting element, light receiving element, protective element, or the like, to the conducting member and / or the portion lower body. The conductive connecting member or insulating conductive member can be selected, according to the substrate on which the element is to be mounted. For example, in the case where the semiconductor light emitting element has semiconductor layers of nitride stacked on a sapphire substrate, which is an insulating substrate, the connecting member can be insulating or conductive. In the case where a conductive substrate is used, as a SiC substrate, electrical conductivity can be established with the use of a conductive connecting member. The insulating bonding member can be formed using an epoxy resin composite, silicone resin composite, polyamide resin composite, modified resin or hybrid resin thereof, or the like. In the case where these resins are used, due to the deterioration caused by the light and / or the heat generated from the semiconductor light emitting element, a metal layer with high reflectivity, such as Al layer or Ag layer or dielectric reflective layer , can be displayed on the rear surface of the light emitting element. In this case, a method, for example, of vapor deposition, recovery, thin layer bonding, or the like, can be used. The conductive connecting member can be formed using a conductive paste in silver, gold, palladium, eutectic welding material, such as Au-Sn, brazing material, such as low melting temperature metal, or the like. In addition, in the event that, between
Petition 870190088974, of 09/09/2019, p. 32/60 / 49 these link members, in particular, an optically transmissive link member, a fluorescent member capable of absorbing light from the semiconductor light emitting element and emitting light of different wavelength, may be contained in the member binding.
(Conductive Wire) [0066] The conductive wires used to electrically connect the light emitting element and the respective conducting members can be formed by metal, such as gold, copper, platinum, aluminum and their alloys. It is particularly preferable to use gold that has excellent thermal resistance, etc.
(Wavelength Conversion Member) [0067] The sealing member may include a fluorescent member, such as the wavelength conversion member, which absorbs at least part of the light emitted from the light emitting element and emits light of different wavelength.
[0068] The fluorescent member capable of converting light from a light-emitting element into light of longer wavelength offers greater efficiency. However, the fluorescent member is not limited to those above, and several fluorescent members capable of converting light emitted from a light-emitting element into light of shorter wavelength, or capable of converting light that has been converted by another fluorescent member. The wavelength-converting member can be formed by a single layer of one type of fluorescent member, a single layer of a mixture of two or more types of fluorescent members, a stacked layer of two or more single layers that contain one type fluorescent member or a stacked layer of two or more single layers, each containing a mixture of two or more types of fluorescent members.
Petition 870190088974, of 09/09/2019, p. 33/60 / 49 [0069] In the case where the semiconductor light element has a nitride-based semiconductor, while its light emitting layer is used as the light emitting element, a fluorescent member capable of to absorb light from the light-emitting element and emit light of a different wavelength. For example, the fluorescent material based on nitride or fluorescent material based on oxynitride, activated mainly by a lanthanide element, such as Eu and Ce. More specifically, it is preferable to use at least a selection from the following elements: (a) fluorescent materials based on a- or B-sialon, various fluorescent materials of silicate nitride in alkaline earth metal and various fluorescent materials of nitride of alkaline earth aluminum silicate which are activated with Eu (for example, CaSiAIN3: Eu, SrAISi ₄ N7: Eu); (b) alkaline earth halogen metal apatites, alkaline earth metal halosilicates, alkaline earth metal silicates, alkaline earth metal haloborates, alkaline earth metal aluminums, alkaline earth metal sulphides, alkali earth metal thiogolates and alkaline earth metal of silicon or germanates in alkaline earth metal that are activated mainly with a lanthanide element, like Eu or a transition metal element, like Mn; (c) rare earth aluminates, rare earth silicates and rare earth alkaline earth silicates which are activated mainly with a lanthanide element, such as Ce; and (d) organic compounds and organic complexes that are activated mainly with a lanthanide element, such as I. A YAG-based fluorescent material, which is a rare-earth aluminous fluorescent material, with a lanthanide element, such as Ce, is preferable. The YAG-based fluorescent material can be represented by formulas, such as Y3AI5O12: Ce, (Y0.8Gd0.2) 3AI5O12: Ce, Y3 (Al0.8Ga0.2) 5O12: Ce and (Y, Gd) 3 (Al, Ga) 5O12. Examples of fluorescent aluminized terrarara materials also include Tb3AI5O12: Ce and Lu3AI5O12: Ce formed with the
Petition 870190088974, of 09/09/2019, p. 34/60 / 49 replacement of part or all Y by Tb or Lu. In addition, fluorescent members, other than those described above, having similar properties, performance and effects, can also be used.
[0070] A member made with a molded body, such as glass and resin composition, and covered with a fluorescent member can also be used. In addition, a molded body containing a fluorescent member can also be used. For example, glass containing fluorescent material, compact and sintered YAG, YAG and AbO3 sintered body, SiO2, B2O3, or similar, inorganic and crystallized YAG material precipitated in inorganic fusion, etc. can be used. In addition, a molded article of fluorescent material entirely molded with epoxy resin, silicone resin, hybrid resin or the like can be used.
(Light Emitting Element) [0071] In the present modality, the semiconductor element of several structures, such as a structure that has positive and negative electrodes formed on the same side, a structure that has positive and negative electrodes formed on different sides and a structure having a substrate different from the bound growth substrate can be employed as the light emitting element (semiconductor light emitting element).
[0072] The semiconductor light emitting element of any appropriate wavelength can be used. For example, in relation to the light emitting element capable of emitting blue or green light, ZnSe, a nitride-based semiconductor (InxAIyGa1-x-yN, 0 <X, 0 <Y, X + Y <1), can be used or GaP. Regarding the light emitting element capable of emitting red light, GaAIAs, AIInGaP or similar can be used. A semiconductor light emitting element made of a material other than that described above can also be employed. The composition, the color
Petition 870190088974, of 09/09/2019, p. 35/60 / 49 of the light emitted, the size and number of the light emitting element to be employed can be selected appropriately, according to the purpose.
[0073] In the case where the light emitting device has a member that converts the wavelength to be obtained, it is appropriate to employ a semiconductor nitride (InxAIyGa1-x-yN, 0 <X, 0 <Y, X + Y <1) capable of emitting light of a short wavelength that can effectively activate the limb that converts the wavelength. The emission wavelength can be selected in a varied way between the materials and the ratio of the mixed crystal content of the semiconductor layer.
[0074] The light emitting element capable of emitting ultraviolet light or infrared light can also be used, as well as the light emitting element capable of emitting visible light. In addition, the light receiving element or the like can be mounted with the light emitting element or mounted separately.
(Support Substrate) [0075] The support substrate (not shown in FIG. 1A and FIG. 1B) has a plate or film-shaped member formed by a metal, or that includes a metal, used to form the conductive member with galvanization and be removed before the aggregate of the light emitting device is cut into individual light emitting devices in the final step, thus the supporting substrate is not a member included in the light emitting device . Regarding the support substrate, the insulating plate formed by polyamide or similar presented with a conductive film formed by means of casting or vapor deposition can be used, as well as the metal plate that has electrical conductivity, such as the SUS plate. Alternatively, a flat, insulating member capable of attaching a thin metallic or similar film to it is used. IS
Petition 870190088974, of 09/09/2019, p. 36/60 / 49 it is necessary that the support substrate is removed in the final stage of the manufacturing process, that is, it is necessary that it be detached from the conductive member and the basic body. For this reason, it is necessary that a folding member be used for the support substrate, and, although it depends on the material, a flat member that is around 10 pm to 300 pm thick is preferably used. The support substrate is preferably formed using a metal plate, such as iron, copper, silver, kovar, nickel and polyamide resin film capable of binding the thin metal film, or similar, on it, as well as SUS card described above. In particular, various types of stainless steel are preferably used, such as martensitic, ferritic, austenitic, etc. Ferritic stainless steels are particularly preferable. Series 400 stainless steels and series 300 stainless steels are particularly preferable. In addition, SUS430 (10.4x10 ^-6 / K), SUS444 (10.6x10 ^-6 / K), SUS303 (18.7x10 ^-6 / K), SUS304 (17.3x10 ^-6 / K) and the like are used appropriately. In the case where the acid treatment is carried out as a pre-treatment of galvanization, the surface of stainless steel series 400 tends to be rougher than that of stainless steel series 300. Naturally, the surface of the galvanized layer formed on the surface of the steel 400 series stainless steel treated with acid also tends to be rough. With this, the adhesion to the sealing member and the resin that make up the basic body can be improved. On the other hand, the surface of 300 series stainless steels does not tend to be rough. In this way, with the use of 300 series stainless steels, the brightness of the galvanized surface can be easily improved, and, of course, the light reflectivity of the light emitting element can be improved, so that the light emitting device presents can produce efficiency in the extraction of light.
[0076] In the event that the brightness on the surface of the conducting member must be improved, techniques such as galvanizing,
Petition 870190088974, of 09/09/2019, p. 37/60 / 49 vapor deposition or casting. The surface of the support substrate is preferably even for the further improvement of the gloss. For example, in the case where SUS is used as the support substrate, SUS 300 series, which has relatively small grain outlines, is used to obtain the outermost surface of the conductive member with high surface brightness.
[0077] In addition, to reduce potential distortion after molding, appropriate processing can be applied to the support substrate to form a crack, groove or waveform.
(Mold Release Film) [0078] The mold release film (film) is arranged in the portion where the mold resin should be injected, to facilitate easy release (easy removal) of the molded body from the mold, and, for example, in the case where the support member is kept between the upper and lower molds during molding, the mold release film is arranged on the lower surface of the upper mold and on the upper surface of the lower mold, respectively.
[0079] To mold the basic body that defines the recess, it is necessary that a protruding portion be formed in the mold. In this way, a mold release film is used which has greater elasticity than the mold and is capable of being stretched to suit the shape of the protruding portion. The mold release film is used to conform to the shape of the mold surface contour by sucking air from the suction orifice shown in the mold, to change the shape of the film for mold release. With the use of the mold release film that has high elasticity, then presenting an opening in the mold release film in a position corresponding to the interior surface, a protruding portion may be formed on the interior surface of the base body recess. This is achieved
Petition 870190088974, of 09/09/2019, p. 38/60 / 49 with the use of the high elasticity of the film to release the mold, allowing the formation of the protruding portion that presents a difficult shape to be formed, only with the use of a rigid mold on the inner surface of the recess.
[0080] The opening shown in the film for mold release can, for example, be circular, quadrangular, rectangular, polygonal, or in a way that is the combination of these shapes, or irregularly. In addition, the opening can be presented before being adhered to the mold or after being adhered to the mold.
[0081] It is preferable that the materials of the mold release film have good removability of the mold, in addition to having good removability of the basic body to be molded. In addition, it is preferable that they have thermal resistance at a molding temperature (130 ° C to 190 ° C). For example, thermoplastic fluororesin (for example, PTFE and ETFE), polyolefin polymer (TPX), nylon or the like are preferably used, and in addition to the basic body, the thermosetting resin described above is preferably used.
[0082] The thickness of the mold release film is preferably between 10 pm to 100 pm, more preferably between 20 pm to 75 pm, and still more preferably between 30 pm to 50 pm. In addition, to stretch and match the irregular shape shown in the mold, the mold release film preferably has a stretch ratio between 500 and 1,000%, more preferably between 600 and 900%. The protruding portion is designed so that its height from the inner surface is determined by the thickness of the mold release film stretched across the mold at the time of molding, and its shape is determined by the shape of the stretched film for mold release. [0083] The mold release film is formed as a single layer or multiple layer. The mold release film
Petition 870190088974, of 09/09/2019, p. 39/60 / 49 made with a single layer has excellent flexibility and has the advantage that it can be applied thinly to suit the contour of the mold. The mold release film made of a plurality of layers can maintain the size of the opening, which is presented in the mold release film, while maintaining its increased strength. In the case where a mold release film made of a plurality of layers is used, different or equal materials can be appropriately selected for each layer, and, for example, they can be formed by films that have different expansion and contraction ratios. In addition, the mold release film can be selected due to the film's stretching direction, relief direction or the like.
(MANUFACTURING METHOD) [0084] The method of manufacturing the light emitting apparatus, according to Example 1, is described below.
1. First Step [0085] First, a support substrate formed by a metal plate and the like is prepared. A protective varnish is applied to the surface of the support substrate as a protective film. With the thickness of the protective varnish, the thickness of the conductive member to be formed later can be adjusted. The protective varnish can be formed not only on the upper surface of the support substrate, but also on the lower surface (surface on the opposite side). In this case, the presentation of the protective varnish on the substantially entire surface on the opposite side prevents the formation of the conductive member on the lower surface with galvanizing, to be described later.
[0086] In the case where the protective film (protective varnish) is formed using photolithography, the protective film (protective varnish) can be of the positive or negative type. In this modality, a
Petition 870190088974, of 09/09/2019, p. 40/60 / 49 method that uses the protective varnish of the positive type, however it can also be used in the combination the positive type and the negative type. Other methods can also be used, such as the formation of the protective varnish by means of serigraphy or bonding of the protective varnish in the form of a film.
[0087] After drying the protective varnish that is applied, a mask presented with openings is placed directly or indirectly on the protective varnish, and then the ultraviolet light is applied by the mask to expose the protective varnish. The wavelength of the ultraviolet light used in this step can be selected according to the sensitivity, or something similar, of the protective varnish. Then, a treatment is carried out using a caustic liquid to form the protective varnish, including the openings. If necessary, an acid activation or similar treatment can be performed at this stage.
[0088] Then, the galvanization is carried out with the use of metal to form the conductive members in the openings of the protective varnish. At this time, galvanizing can be carried out to obtain a greater thickness than that of the protective varnish by adjusting the galvanizing conditions. In this way, the conductive members can be formed on the upper surface of the protective varnish (protective film), so that the laterally protruding portion, as shown in FIG. 1A, can be formed. The galvanizing method can be formed, appropriately, from the methods known in the art, according to the metal to be used, or according to the desired thickness and flatness. For example, a method, such as electrolytic or non-electrolytic galvanization, can be employed. Electrolytic galvanizing is particularly and preferably used, which facilitates the removal of the protective varnish (protective film) and the formation of the conductive members with a sufficiently uniform shape. In addition, to improve adhesion to the outermost layer of the surface (eg, Ag), an
Petition 870190088974, of 09/09/2019, p. 41/60 / 49 intermediate layer (eg Au, Ag) below the outermost surface layer through pre-galvanization. After galvanizing, the protective film is washed and removed to form a plurality of spaced conductive members.
2. Second Stage [0089] Next, a basic body capable of reflecting light from the light emitting element is formed between the conducting members. All portions of the basic body, the lower portion and the side surface portion, in addition to the protruding portions formed on the inner surface of the side surface portion, are integrally molded in this step.
[0090] Molding can be performed using a method, such as injection molding, transfer molding or compression molding. For example, in the case where the basic body is formed using transfer molding, a support substrate, which has a plurality of conducting members disposed in it, is positioned in a mold, to be maintained between the upper surface and the bottom surface of the mold. At this time, in the case where the upper mold is presented in the recess of the conductive member, a protruding portion is formed on the lower surface of the upper mold, and the film for releasing the mold is attached to the integral lower surface, including the protruding portion. In the case where the compression mold method is used, the mold release film can be used in the same way.
[0091] The mold release film can be previously presented with the opening, or the opening can be presented after the film is attached to the mold. In this case, for example, the mold release film is pushed against the side of the lower surface of the upper mold that has the protruding portion formed therein, in addition to being stretched by suction or something similar, to fit the portion
Petition 870190088974, of 09/09/2019, p. 42/60 / 49 protruding from the mold. Then, the resin is injected under pressure, so that the mold release film is stretched by the resistance of the resin flow, exceeding its elastic limit, easily producing an opening in the lateral surface of the protruding portion of the mold, a position corresponding to the surface inside the recess in the basic body after molding.
[0092] Resin pellets, raw material of the basic body, are loaded in the mold, being heated the support substrate and resin pellets. After the resin pellets are melted, pressure is applied to fill the molten resin in the mold and in the film openings for mold release. The heating temperature, heating time and pressure, and similar data, are adjusted appropriately according to the composition or similar of the resin. After curing, the molded body is removed from the mold and the film to release the mold.
3. Third Step [0093] Then, when using a connecting member, the light emitting element is connected to the bottom surface of the recess in the basic body and is electrically connected to each conducting member, using a conductive wire.
4. Fourth Step [0094] Next, a sealing member that contains optically transmissive resin is filled into the recess. In this way, the light-emitting element is covered with the sealing member. The sealing member is preferably arranged at approximately the same height as the side wall of the recess, but is not limited to it, the height may be lower or higher than the side wall. In addition, the upper surface may be a flat surface, as described above, or a curved surface, with its central portion depressed or protruding. The sealing member can have a single layer structure or multilayer structure
Petition 870190088974, of 09/09/2019, p. 43/60 / 49 made with two or more layers that have different compositions and / or properties.
[0095] The aggregate of the light emitting devices is obtained by curing the sealing member, and the supporting substrate is removed from the aggregate.
5. Fifth Stage [0096] Finally, the side wall between the recesses is cut into individual chips, and the light emitting device presented with a single recess, as shown in FIG. 1A, can be obtained. Various methods can be used to separate the individual devices, such as a cutting method using a blade and a cutting method using a laser beam.
Example 2 [0097] Example 1 described above illustrates an example in which the protruding portion is arranged on the shorter side of the inner surface of the side wall. However, the protruding portion may be arranged on the longer side, rather than on the shorter side, or in addition to the shorter side. As in Example 2, the examples already described are shown in FIG. 2A to FIG. 2C. In these figures, FIG. 2A is a perspective view showing the light emitting apparatus 200 of Example 2, FIG. 2B is a cross-section taken along line IIB-IIB 'of FIG. 2A, and FIG. 2C is a cross-sectional view taken along the line IIC-IIC 'of FIG. 2A, respectively. The light emitting devices 200 shown in FIG. 2A to FIG. 2C and the light emitting apparatus 100 shown in FIG. 1 show the denoted reference numbers of each of the members where the last two digits correspond to the same members, therefore, it is appropriate to omit the detailed description about each member of the light emitting device 200.
[0098] The basic body 201 of Example 2 is also shown with the protruding portion 201c 'on the longest side of the interior surface of the
Petition 870190088974, of 09/09/2019, p. 44/60 / 49 side wall, in addition to the protruding portion 201c arranged in the curved portion on a shorter side, as in the basic body 101 of Example 1. In this example, integrally with the basic body, the protruding portion 201c 'is arranged on the surface interior of the side wall portion 201a of the basic body and in a position close to the rising portion of the side wall portion 201a of the lower portion 201b. The protruding portion 201c 'is formed with a protruding shape in the recess S, in the same way as the protruding portion 201c. With this arrangement, the connection area at the connection interface between the sealing member 204 filled in the recess S and the basic body 201 can be further increased and, in addition, with the anchoring effect of the protruding portion 201c and 201c ', the sealing member 204 can be securely attached to the recess. Particularly, in the example shown in FIG. 2A, the protruding portion 201c is arranged on each of the portions of the opposite curved surface, and the protruding portion 201c 'is arranged on each of the portions of the flat surface between the opposite portions of the curved surface, to increase the attachment points with the sealing member 204, and its security may be further increased.
[0099] In addition, the light emitting apparatus 200 has a lower portion 201b, which is integrally combined with a pair of side wall portions 201a, defining the recess S on the lower surface side of the basic body 201, and has a protruding portion 201c 'disposed above each of the two ends of the lower portion 201b. Specifically, each protruding portion 201c 'is arranged in a location that is close to the edge between the coated conductive members 202 and the lower portion 201b of the basic body disposed between them, and which is close to the corner portion where each conductive member 202 enters in flat contact with the side wall portion 201a at an approximately particular angle. With the basic body 201 showing protruding portions integrally formed 201c ’, each of which is highlighted into the
Petition 870190088974, of 09/09/2019, p. 45/60 / 49 side wall portion 201a of recess S at a location close to the corner portion of each conductive member 202, as described above, the detachment between conductive member 202 and the bottom surface 201b, due to the difference in its quotient thermal expansion, can be prevented effectively.
[0100] This is achieved because the protruding portion 201c 'increases the connection area in relation to the sealing member 204, which is filled in the recess S, which allows the solid connection with the sealing member 204 to be made. That is, the detachment or separation of the sealing member 204 caused by the increase in temperature or the like can be prevented by the protruding portion 201c '. As a result, the condition is such that the sealing member 204 pushes a large area of the conductive members 202 and the lower portion 201b down, so that adhesion can be maintained at the same time that they are prevented from disengaging. Specifically, the lower surface of the recess S is formed by the conducting members 201 and the lower portion 201b of the basic body which are made of different materials. In this way, the protruding portion 201c 'arranged in this region in the vicinity of its boundary region, that is, in the lower region of the side wall portion 201a, can effectively obtain the effect described above, thus being preferable.
[0101] The shape and arrangement of protruding portions 201c, 201 ’in
Example 2 can be stipulated as in the protruding portion 101c of Example 1. The protruding portions 101c, 201c, 201c 'are preferably arranged on the side walls on both sides of the recess S, however they can be arranged only on one side of the side wall .
(Lower Block Depression 201f) [0102] Furthermore, in addition to the above, a blocking structure can be provided to increase adhesion to the sealing member not only on the side wall of the recess, but also on the lower portion, that is, on the surface lower body. The locking structure is not limited to
Petition 870190088974, of 09/09/2019, p. 46/60 / 49 protruding portion, a depression can be used. In the lower portion, in particular, depression is preferable due to the ease of formation. For example, the depression can be easily formed by partially projecting a peeled film towards the bottom portion 201b at the time of mold preparation.
[0103] The light emitting apparatus 200 shown in FIG. 2A shows the depression of the lower block 201f in a part of the lower portion 201b of the basic body. The depression of the bottom lock 201f is shown as shown in the cross-sectional view of FIG. 2C, a depressed region in the lower portion 201b of the basic body. The depression of the lower block 201f is shown to partially reduce the thickness of the lower portion 201b, not penetrating the base body 201. In addition, the depression of the lower block 201f is formed upwards, increasing the tapered opening. The depression shown allows the sealing member 204 to be filled in the recess S, to form a non-flat connection interface with the lower surface of the basic body 201, in addition to its peripheral portion, so that the resin bond can be improved, also improving the strength of adhesion. With the depression in the lower portion of the basic body, the fixation of the sealing member can be increased, even in a type in which the protruding portion of the side wall is not shown.
[0104] In the depressions of the bottom lock 201f shown in FIG. FIG. 2C, each of them has an oval opening in the top view, but the shape is not specifically limited, a rectangular shape or a circular shape can be used. The shape of the depression opening of the lower lock 201f can be changed in its depth direction, for example, the oval shape on the upper side and the circular shape on the lower side. In addition, the depression of the lower block 201f can be presented as a single depression or a plurality of depressions.
[0105] In addition, there may be another depression in depression.
Petition 870190088974, of 09/09/2019, p. 47/60 / 49
This variant example is shown in the enlarged cross-sectional view of FIG. 2D. The depression of the lower block 201f, shown in the figure, is shown as a double recess in which the degree of depression is changed in the depth direction. The depression of the bottom lock 201f, shown in FIG. 2D, it is shown in the sense that the opening diameter of the lower lock depression 201f is decreased step by step, to form a step symmetrical configuration approximately symmetrical in the transverse direction. Specifically, the depression of the bottom block 201f is presented with its opening diameter that decreases in two steps. In detail, the first lower depression 206 shown on the upper surface of the lower portion 101b of the basic body, showing a first opening diameter, and the second lower depression 207, showing a second opening diameter smaller than the first opening diameter, are formed integrally in the depth direction. The depression of the lower block 201f shown in the lower portion 201b with the opening diameter, which decreases in the form of several steps, allows the formation of the interior surface of the depression with a complex shape. As a result, the interior surface area of the depression of the lower block 201f can be increased, so that the adhesion to the sealing member 204 filled in the recess can be further increased.
[0106] In Example 2, the inner surface of the first lower depression 206 and the second lower depression 207 each is formed as a curved surface, i.e., a curved contoured recess and a rounded corner. This is preferable due to the ease of manufacturing the depression of the rounded bottom lock 201f. The depression of the bottom lock 201f can be formed by a rectangular shape. The opening diameter of the bottom lock depression 201f can be reduced in three or more steps or gradually.
[0107] In addition, in the light emitting device 200 presented with
Petition 870190088974, of 09/09/2019, p. 48/60 / 49 the depression of the lower block 201f of the basic body, in addition to the protruding portions 101c, 201c, 201c 'of Example 1 and Example 2, the adhesion to the sealing member 204 can be increased from multiple directions of the basic body 201. That is, in the cases of FIG. 1 and FIG. 2, the interior wall surface of the basic body is presented with an irregular portion and with a protruding portion or depression in three dimensional directions, as the side wall surfaces of the shortest and longest side and the bottom surface of the recess S , so that the suitability of the sealing member 204 to the irregular portion allows the anchor effect to be increased.
(Protruding Portion Example) [0108] In addition, the examples shown in Example 1 and Example 2 illustrate protruding portions protruding from the recess that are formed in the form of a truncated cone, but the protruding portion is not limited to it, and several shapes can be selected. In particular, due to the improvement of the anchor effect in relation to the sealing member, the outer diameter is preferably increased near the tip of the protruding portion. An example of a variant of it is shown in FIG. 3. The light emitting apparatus shown in FIG. 3 is an example of a variant of the protruding portions 101c, 201c and 201c 'of Example 1 and Example 2, and the members, with the exception of the protruding portions, are the same as those shown in FIG. 1 and FIG. 2. In this way, each of the corresponding members is referenced by a number with the same last two digits and the description is omitted as appropriate. The protruding portion 301c shown in FIG. 3 is made in the shape of a mushroom that has an approximately T-shaped cross section, which has a stem portion 301d projected approximately perpendicularly to the side wall portion 301a and a flat portion 301e at the tip of the stem portion 301d, extended in the direction approximately perpendicular to the axis direction of the stem portion 301d. Due to its irregular shape, the protruding portion
Petition 870190088974, of 09/09/2019, p. 49/60 / 49
301c, which has a T-shaped cross, can further increase the adhesion to the sealing member 304. The contact area with the sealing member 304 is further increased, so that the adhesion to the sealing member 304 can be further increased. increased, so it is preferable.
(Manufacturing Method) [0109] The manufacturing method for the 200 light emitting device of the
Example 2 is roughly the same as the manufacturing method of the light emitting apparatus 100 of Example 1, the detailed description about the same step being omitted. Specifically, in the manufacturing method of Example 2, the position of the opening shown in the mold release film, which is described in the second step of the method of Example 1, is specified below. That is, the opening of the mold release film is presented in a position corresponding to the upper corner of the conductive member when the mold is assembled, and the protruding portion 201c described above can be obtained.
[0110] In addition, the method of fabricating the transverse T-shaped protruding portion is described below. The positions of formation of the openings in the mold release film correspond, as in the mold of step 2, to the interval between the pair of conductive portions 202 which constitute the lower potion 201b of the basic body and the region bordering the space between the upper mold and the lower mold with which the side wall portion 201a of the basic body is formed. The pressure of the injected resin differs in the border region due to the difference in the spatial volume between the respective injection regions. Particularly, in the mold, the narrow gap between the conductive members 202 and the region bordering the wide formation space of the side wall portion are susceptible to stress due to the difference in pressure and the flow speed of the resin, so that the resin tends flowing inside the openings in the neighboring regions. The resin flows through the opening of the film to release the mold and, in
Petition 870190088974, of 09/09/2019, p. 50/60 / 49 then, in the gap between the mold release film, spreading over the mold. This spreading forms the flat portion 301e of the protruding portion 301c, and the filled resin in the opening portion forms the stem portion 301d, respectively.
[0111] In this way, by adjusting the flow of the resin, for example, and by increasing the tension of the resin by design, the flow of the resin in the opening portion of the film for mold release can be increased, in addition to increasing the amount of the flow of the resin, which passes through the opening portion of the film for mold release, and the proportion of the gap between the film for mold release, the diameter of the flat portion 301e and the protruding portion 301c may be increased. Alternatively, the reverse can occur, in which the inflow pressure and / or resin inflow speed are adjusted to control the diameter and / or the thickness of the protruding portion.
[0112] After the resin is cured, the protruding portion 301c is forced by the opening portion of the film to release the mold, to remove the basic body of the mold and the film to release the mold. In particular, it is preferable that, on the flat portion 301e, there is a larger diameter compared to the portion of step 301d, and the mold release film is stretched to increase the opening, allowing the flat portion 301e to pass through it.
[0113] In addition, the method of forming depression of the lower block 201f is described below. At the time of assembly of the mold in the second step described above, the mold release film is adjusted to be able to maintain its elasticity on a part of the lower surface of the projecting portion of the upper mold to which the mold release film is attached. Specifically, the elasticity of the mold release film in the region of disposition of the conductive member 202 is maintained with the placement of the mold, at the same time that it is adjusted to
Petition 870190088974, of 09/09/2019, p. 51/60 / 49 thickness of the film for mold release in the mold slot, which is achieved by suction of the film for mold release by vacuum through the upper mold slot. In this way, the conductive member is interposed between the upper and lower molds for its placement and the tension is applied to the film to release the mold in the upper mold. At this time, the elasticity of the mold release film is maintained in the disposed region of the conductive member 202, and the mold release film is firmly adhered to the support substrate. Meanwhile, in the region of formation of the lower portion 201b of the basic body, that is, in the gap created between the mold and the pair of conductive members 202, the mold release film, which is deformed (stretched) by pressure, is pulled to the crack. That is, the mold release film, which has a greater width than the width of the gap between the pair of conducting members, is collected in the gap, with deformation occurring.
[0114] As a result, the occurrence of deformation of the mold release film in the arranged region of the conductive member 202 can be prevented, so that the adhesion between the conductive member 202 and the mold release film can be increased, and the resin flow may be impeded by any conductive member 202. At the same time, in the slit of the mold corresponding to the formation region of the lower part 210b of the basic body, the upper surface of it can be formed by the part of the film that is deformed downwards, to that the resin can be formed and suitable for this special configuration. That is, the depression of the bottom lock 201f of the basic body can be obtained with the shape appropriate to the shape of the gap in the resin film.
[0115] In addition, as described above, the formation of the film for detaching mold with multilayer and the depression of the bottom block 201f formed by a plurality of
Petition 870190088974, of 09/09/2019, p. 52/60 / 49 lower depressions. This is achieved by using the properties of the multilayer film that presents elasticity in which the layers in the multilayer film are released with the tension exerted by the mold arrangement. Each of the films has different elasticity, so that the degree of the respective loss downwards in the mold slot can vary, and, as a result, the bottom surface of each multilayer film can be formed in an irregular shape. That is, in the form of the slit of the mold corresponding to the formation of the region of the lower portion 201b of the basic body, the side of the upper surface can be formed by a complex shape in which the irregular shape is obtained with the use of a film for detaching multilayer mold.
Industrial Applicability [0116] The light emitting device, according to the present invention, presents light weight and small size and excellent efficiency and safety in the extraction of light that can be obtained easily. These light emitting devices can be used in applications, such as indicators, lighting devices, displays, backlight sources for liquid crystal displays and digital video cameras, fax machines, copiers, reading systems. scanners or similar and projector devices.
Denomination of Reference Numbers
100 ... light emitting device
101 ... basic body
101a ... side wall portion of basic body
101b ... lower part of the basic body
101c ... protuberant portion
102 ... conducting member
103 ... light emitting element
104 ... sealing member
Petition 870190088974, of 09/09/2019, p. 53/60 / 49
105 ... electrically conductive wire
200 ... light emitting device
201 ... basic body
201a ... side wall portion of the basic body
201b ... lower part of the basic body
201c ... protruding portion
201c ’... protruding portion
201f ... lower block depression
202 ... conducting member
203 ... light emitting element
204 ... sealing member
205 ... electrically conductive wire
206 ... first depression on the bottom surface
207 ... second depression on the bottom surface
301a ... side wall portion
301c ... protuberant portion
301d ... rod portion
301e ... flat portion
302 ... conducting member
303 ... light emitting element
304 ... sealing member
305 ... electrically conductive wire
S ... recessed
Petition 870190088974, of 09/09/2019, p. 54/60

权利要求:
Claims (14)
[1]
1. Light-emitting device characterized by the following:
basic body that forms a recess defined by a lower surface and a side wall thereof;
conducting member having an upper surface exposed on the lower surface of the recess and a lower surface forming an outer surface;
protruding portion formed in the recess;
light emitting element mounted in the recess and electrically connected to the conductive member; and sealing member arranged in the recess to cover the light emitting element, in which the basic body has a lower portion and a side wall portion, formed entirely by a resin, where an internal surface of the side wall portion is side wall that defines the recess and that has a curved portion, where the protruding portion is arranged in proximity to the curved portion, and where the protruding portion is spaced from the bottom surface of the recess.
[2]
2. Light-emitting apparatus according to claim 1, characterized in that the protruding portion is arranged on the side surface that defines the recess.
[3]
3. Light-emitting apparatus according to claim 1 or 2, characterized by the interior surface of the portion of
Petition 870190088974, of 09/09/2019, p. 55/60
2/5 side wall that defines the recess to have an inclined portion in which the degree of the inclination angle is inconsistent, and that the protruding portion is arranged on the inclined portion.
[4]
Light emitting device according to any one of claims 1 to 3, characterized in that the protruding portion is arranged on the portion of the curved surface of the inner surface.
[5]
Light-emitting apparatus according to any one of claims 1 to 4, characterized in that the protruding portion is arranged on the inner surface of the side wall portion close to the lower portion of the basic body.
[6]
A light emitting device according to any one of claims 1 to 5, characterized in that a depression is provided in the lower portion of the basic body.
[7]
7. Light emitting device characterized by the following:
basic body that forms a recess defined by a lower surface and a side wall thereof;
a pair of conductive members, each of which has an upper surface exposed in the recess and a lower surface forming an outer surface;
light emitting element mounted in the recess and electrically connected to the conductive member; and sealing member disposed in the recess to cover the light emitting element, wherein the basic body has a lower portion and a side wall portion, formed entirely by a resin, and
Petition 870190088974, of 09/09/2019, p. 56/60
3/5 in which a depression is provided on the bottom surface of the recess between the conductive members.
[8]
8. Light-emitting device characterized by the following:
basic body that forms a recess defined by a lower surface and a side wall thereof;
conducting member having an upper surface exposed in the recess and a lower surface forming an outer surface;
light emitting element mounted in the recess and electrically connected to the conductive member; and sealing member disposed in the recess to cover the light emitting element, wherein the basic body has a lower portion and a side wall portion, formed integrally by a resin, where an interior surface of the side wall portion has a protruding portion that is spaced from the bottom surface and positioned closer to a bottom of the inner surface than to a top of the inner surface.
[9]
Light emitting apparatus according to claim 8, characterized in that an inner surface of the side wall portion is the side wall that defines the recess and in that it has a flat portion and a curved portion, and that the protruding portion is arranged in the curved portion.
[10]
A light emitting device according to any one of claims 1 to 9, characterized in that the conducting member is a galvanized layer.
Petition 870190088974, of 09/09/2019, p. 57/60
4/5
[11]
Light emitting device according to any one of claims 1 to 10, characterized in that the basic body is formed by a thermosetting resin.
[12]
12. Light-emitting apparatus according to any one of claims 1 to 11, characterized in that the protruding portion is arranged in a plural number in the recess in a height direction or in a horizontal direction.
[13]
13. Resin packaging characterized by comprising the following:
basic body that forms a recess defined by a lower surface and a side wall thereof;
conducting member having an upper surface exposed on the lower surface of the recess and a lower surface forming an outer surface; and protruding portion formed in the recess;
where the basic body has a lower portion and a side wall portion, integrally formed by a resin, where an inner surface of the side wall portion is the side wall that defines the recess and which has a curved portion, where the the protruding portion is arranged in the vicinity of the curved portion, and the protruding portion is spaced from the bottom surface of the recess.
[14]
14. Resin packaging characterized by comprising the following:
basic body that forms a recess defined by a lower surface and a side wall thereof;
Petition 870190088974, of 09/09/2019, p. 58/60
5/5 a pair of conductive members, each of which has an upper surface exposed on the lower surface of the recess and a lower surface that forms an outer surface; and sealing member disposed in the recess;
wherein the basic body has a lower portion and a side wall portion, integrally formed by a resin, and in which a depression is provided on the lower surface of the recess between the conductive members.

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法律状态:
2019-01-08| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|

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2019-07-16| B06T| Formal requirements before examination [chapter 6.20 patent gazette]|

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2020-01-21| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|

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2020-02-18| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 28/10/2010, OBSERVADAS AS CONDICOES LEGAIS. |

优先权:

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申请号 | 申请日 | 专利标题

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JP2009248820|2009-10-29|

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JP2009-248820|2009-10-29|

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PCT/JP2010/069144|WO2011052672A1|2009-10-29|2010-10-28|Light emitting device and method for manufacturing same|

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